Innovation Period: From the 1950s to the 1980s, the United States took the lead in developing ultra-precision machining technology represented by single-point diamond turning. This technology was mainly used for processing large parts such as laser fusion mirrors, and spherical, and aspherical surfaces in the fields of aerospace, national defense, and astronomy.
Early Application in Civil Industry: From the 1980s to the 1990s, ultra-precision machining technology began to be applied in the civil industry. Companies such as Moore Company and Precision Techniques Company in the United States, Toshiba and Hitachi in Japan, and Cranfield in Europe, with government support, commercialized ultra-precision machining equipment and began to use it for the manufacturing of precision optical lenses for civilian use.
Maturity Period: After the 1990s, with the promotion of industries such as automotive, energy, medical equipment, information, optoelectronics, and communication, ultra-precision machining technology gradually matured and was widely applied to the processing of aspherical optical lenses, ultra-precision molds, hard disk drive heads, hard disk substrates, semiconductor wafers, and other parts. The related technologies of ultra-precision machining equipment, such as precision spindle parts, rolling guides, hydrostatic guides, micro feed drives, precision CNC systems, and laser precision detection systems, also matured, and the equipment accuracy approached the nanometer level.
International Development: Internationally, the United States, the United Kingdom, and Japan are leading in ultra-precision machining technology. The United States developed diamond tool ultra-precision cutting technology in the late 1950s, Cranfield Technology Institute's Cranfield Precision Engineering Institute represents the UK's ultra-precision machining technology level, and Japan is currently the fastest developing country in the world for ultra-precision machining technology.
Development in China: China started relatively late in the field of ultra-precision machining, but has made significant progress since the successful development of its own CNC ultra-precision machine tools in 1998. Units such as the Beijing Machine Tool Research Institute, the Aviation Precision Machinery Research Institute, the Harbin Institute of Technology, and the National University of Defense Technology in China can now produce several types of ultra-precision CNC diamond machine tools.
Importance of Ultra-Precision Machining: Ultra-precision machining technology not only reflects the level of mechanical machining of an industrial country but is also an important support technology for modern high-tech warfare, and the foundation for the development of modern high-tech industries and science and technology. With the advancement of technology and the continuous development of the socio-economic, the instruments involved in industrial production are inevitably developing towards precision.
Influencing Factors: The development of ultra-precision machining technology is influenced by various factors, including the pursuit of high product quality, product miniaturization, high reliability, and high performance. These factors collectively promote the development of ultra-precision machining technology.
Research Institutions and Enterprises: Well-known international research institutions and enterprises in ultra-precision machining include the LLL Laboratory and Moore Company in the United States, Granfield and Tayler Company in the United Kingdom, Zeiss Company in Germany, Toshiba Machinery, Toyota Machinery, and Fuji Oil Company in Japan, etc. China began researching ultra-precision machining technology in the early 1980s, with main research institutions including the Beijing Machine Tool Research Institute, Tsinghua University, Harbin Institute of Technology, etc.
These stages summarize the entire development process of high-precision machining technology from the initial concept to mature application, as well as the contributions and development of different countries and regions in this field.
